SMTA - Improve Control Amidst Die shrink, 3D Package Complication

2018 International Wafer Level Packaging Conference (IWLPC)

Author(s): Woo Young Han ; Mike Marshall ; Matt Wilson
Publisher: SMTA
Publication Date: 1 October 2018
Conference Location: San Jose, CA, USA, USA
Conference Date: 23 October 2018
Page(s): 1 - 7
ISBN (Electronic): 978-1-9445-4306-8
DOI: 10.23919/IWLPC.2018.8573292
Regular:

Die sizes continue to shrink and packaging technologies continue to evolve, but the common thread for all of them is the need for increased precision and tighter process control limits to achieve... View More

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