SMTA - Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration

2018 International Wafer Level Packaging Conference (IWLPC)

Author(s): A. Martins ; M. Pinheiro ; A. F. Ferreira ; R. Almeida ; F. Matos ; J. Oliveira ; Eoin oToole ; H. M. Santos ; M. C. Monteiro ; H. Gamboa ; R. P. Silva
Publisher: SMTA
Publication Date: 1 October 2018
Conference Location: San Jose, CA, USA, USA
Conference Date: 23 October 2018
Page(s): 1 - 6
ISBN (Electronic): 978-1-9445-4306-8
DOI: 10.23919/IWLPC.2018.8573275

The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the requirements of potential new markets and applications such as the Internet of Things... View More