SMTA - Thermal Debonding and Warpage Adjust of Fowlp - A Crucial Step in the Evolution of Advanced Packaging?

2018 International Wafer Level Packaging Conference (IWLPC)

Author(s): Sophia Oldeide ; Regine Beckmann ; Laurent Giai-Miniet ; Klemens Reitinger
Publisher: SMTA
Publication Date: 1 October 2018
Conference Location: San Jose, CA, USA, USA
Conference Date: 23 October 2018
Page(s): 1 - 6
ISBN (Electronic): 978-1-9445-4306-8
DOI: 10.23919/IWLPC.2018.8573267
Regular:

Fan-out technology has gained a lot of traction in the advanced packaging area for the last several years. It has been a hot topic of attention as it provides several advantages as compared to... View More

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