SMTA - Advanced EWLB (Embedded Wafer Level Ball Grid Array) Solutions for Mmwave Applications

2018 International Wafer Level Packaging Conference (IWLPC)

Author(s): Dian Wang ; Fazhi An ; Seung Wook Yoon
Publisher: SMTA
Publication Date: 1 October 2018
Conference Location: San Jose, CA, USA, USA
Conference Date: 23 October 2018
Page(s): 1 - 6
ISBN (Electronic): 978-1-9445-4306-8
DOI: 10.23919/IWLPC.2018.8573266

FOWLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due... View More