SMTA - Optical Run-Out Correction for Improved Lithography Overlay Accuracy for Fowlp Applications

2018 International Wafer Level Packaging Conference (IWLPC)

Author(s): Markus Arendt ; Matthew Gingerella ; Habib Hichri
Publisher: SMTA
Publication Date: 1 October 2018
Conference Location: San Jose, CA, USA, USA
Conference Date: 23 October 2018
Page(s): 1 - 7
ISBN (Electronic): 978-1-9445-4306-8
DOI: 10.23919/IWLPC.2018.8573279
Regular:

In Fan-Out wafer level packaging (FOWLP), errors from the die placement robot, and from expanding and shrinking mold compound in which the dies are embedded (magnification error), lead to... View More

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