SMTA - High Speed 3D Inspection of Advanced Package Interconnect Uniformity

2018 International Wafer Level Packaging Conference (IWLPC)

Author(s): Zonghu He ; John Schaefer
Publisher: SMTA
Publication Date: 1 October 2018
Conference Location: San Jose, CA, USA, USA
Conference Date: 23 October 2018
Page(s): 1 - 6
ISBN (Electronic): 978-1-9445-4306-8
DOI: 10.23919/IWLPC.2018.8573291
Regular:

Industry trend toward devices with higher bump densities is driving a need for advances in test equipment for measuring the uniformity of bump height across a device. As bump height decreases,... View More

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