IEEE - Institute of Electrical and Electronics Engineers, Inc. - Can AI help reliability analysis of 3D IC mobile devices?

2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

Author(s): K. N. Tu ; Yingxia Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2018
Conference Location: Qingdao, China, China
Conference Date: 31 October 2018
Page(s): 1 - 4
ISBN (CD): 978-1-5386-4439-3
ISBN (Electronic): 978-1-5386-4441-6
ISBN (Paper): 978-1-5386-4440-9
DOI: 10.1109/ICSICT.2018.8564923
Regular:

In the big data era, the use of consumer electronic products in all aspects of our life is manifested by the ubiquitous presence of mobile devices. The continuing demand for smaller size, more... View More

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