IEC - International Electrotechnical Commission - IEC 63011-3:2018
Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 November 2018 |
| Status: | published |
| Page Count: | 28 |
| ICS Code (Integrated circuits. Microelectronics): | 31.200 |
abstract:
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit... View More
Document History
IEC 63011-3:2018
November 28, 2018
Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and...