IEEE - Institute of Electrical and Electronics Engineers, Inc. - Non-Invasive Control Solution inside Higher-Level OPC UA based Wrapper for Optimizing Groups of Wastewater Systems

2018 IEEE 23rd International Conference on Emerging Technologies and Factory Automation (ETFA)

Author(s): Adrian Korodi ; Mihaita-Alin Radu ; Ruben Crisan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2018
Conference Location: Turin, Italy
Conference Date: 4 September 2018
Volume: 1
Page(s): 597 - 604
ISBN (Electronic): 978-1-5386-7108-5
ISBN (USB): 978-1-5386-7107-8
ISSN (Electronic): 1946-0759
DOI: 10.1109/ETFA.2018.8502550
Regular:

Interoperability is a key attribute of systems nowadays in the industry. It enables local devices towards integration into higher-level supervisory/management structures and assures... View More

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