IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging

Author(s): Junhui Li ; Qing Tian ; Haoliang Zhang ; Xinxin Chen ; Xiaohe Liu ; Wenhui Zhu
Sponsor(s): IEEE Industrial Electronics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2018
Volume: 14
Page(s): 4,746 - 4,754
ISSN (Electronic): 1941-0050
ISSN (Paper): 1551-3203
DOI: 10.1109/TII.2018.2805297
Regular:

In order to develop the flux dipping process, a quantitative mathematical model that accurately describes the flux dipping process in the flip-chip bonding is proposed. The whole dynamic dipping... View More

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