IEEE - Institute of Electrical and Electronics Engineers, Inc. - Monitoring 3-D Temperature Distributions and Device Losses in Power Electronic Modules

Author(s): Christoph H. van der Broeck ; Robert D. Lorenz ; Rik W. De Doncker
Sponsor(s): IEEE Power Electronics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 1941-0107
ISSN (Paper): 0885-8993
DOI: 10.1109/TPEL.2018.2882402
Regular:

This paper presents a methodology for real-time monitoring of 3-D temperature distributions and device losses within power electronic modules. It allows precise thermal management, empirical... View More

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