IEEE - Institute of Electrical and Electronics Engineers, Inc. - Applications of Three Dimensional Laser Induced Metallization Technology with Polymer Coating

2018 13th International Congress Molded Interconnect Devices (MID)

Author(s): Chieh Yang ; Min-Chieh Chou ; Tune-Hune Kao ; Meng-Chi Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2018
Conference Location: Wu¨rzburg, Germany
Conference Date: 25 September 2018
Page(s): 1 - 6
ISBN (Electronic): 978-1-5386-4933-6
ISBN (USB): 978-1-5386-4932-9
DOI: 10.1109/ICMID.2018.8527010
Regular:

A fully developed technology of three dimensional laser induced metallization (LIM) on molded interconnect devices (MIDs) is widely used on various products. The target substrate is sprayed with a... View More

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