IEEE - Institute of Electrical and Electronics Engineers, Inc. - Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability

2017 IEEE 44th Photovoltaic Specialists Conference (PVSC)

Author(s): Nick Bosco ; Joshua Eafanti ; Sarah Kurtz ; Jared Tracy ; Reinhold Dauskardt
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2017
Conference Location: Washington, DC, USA
Conference Date: 25 June 2017
Page(s): 3,190 - 3,194
ISBN (Electronic): 978-1-5090-5605-7
DOI: 10.1109/PVSC.2017.8366641
Regular:

The width-tapered cantilever beam method is used to quantify the debond energy (adhesion) of encapsulant and backsheet structures of 32 modules collected from the field. The collected population... View More

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