IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrathin Silicon-an-Insulator (SOI) Wafer for Compliant Substrate

2017 IEEE 44th Photovoltaic Specialists Conference (PVSC)

Author(s): Shinyoung Noh ; Anita Ho-Baillie ; Stephen Bremner ; Martin A. Green ; Xiaojing Hao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2017
Conference Location: Washington, DC, USA
Conference Date: 25 June 2017
Page(s): 858 - 860
ISBN (Electronic): 978-1-5090-5605-7
DOI: 10.1109/PVSC.2017.8366027
Regular:

Compliant substrate is one of the most promising approaches for heteroepitaxy of the semiconductor devices. SO! wafer is the only commercial structure used for the compliant substrate researches.... View More

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