IEEE - Institute of Electrical and Electronics Engineers, Inc. - Scalable De Novo Genome Assembly Using Pregel

2018 IEEE 34th International Conference on Data Engineering (ICDE)

Author(s): Da Yan ; Hongzhi Chen ; James Cheng ; Zhenkun Cai ; Bin Shao
Sponsor(s): IEEE Comput. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2018
Conference Location: Paris, France
Conference Date: 16 April 2018
Page(s): 1,216 - 1,219
ISBN (Electronic): 978-1-5386-5520-7
ISSN (Electronic): 2375-026X
DOI: 10.1109/ICDE.2018.00114
Regular:

De novo genome assembly is the process of stitching short DNA sequences to generate longer DNA sequences, without using any reference sequence for alignment. It enables high-throughput genome... View More

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