IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Scalable Low-Cost Manufacturing to Hybridize Infrared Detectors with Si Read-Out Circuits

2018 IEEE Research and Applications of Photonics In Defense Conference (RAPID)

Author(s): Pouya Dianat
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Miramar Beach, FL, USA
Conference Date: 22 August 2018
Page(s): 1 - 3
ISBN (Electronic): 978-1-5386-5349-4
DOI: 10.1109/RAPID.2018.8508935
Regular:

A new device-chip hybridization method is described as a scalable manufacturing technique for infrared imagers and sensors. This method avoids low-yield, therefore costly, flip-chip bonding. A... View More

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