IEEE - Institute of Electrical and Electronics Engineers, Inc. - Aging effect on defect evolution and shear strength of nano-silver solder joint

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): He Gong ; Yao Yao ; Jundong Wang ; Shaobin Wang ; Xu Long
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 867 - 871
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480660
Regular:

This paper focus on investigating the aging effect on defect evolution and shear strength of nano-silver solder joint. The thermal aging experiments and uniaxial shear experiments were conducted... View More

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