IEEE - Institute of Electrical and Electronics Engineers, Inc. - Random Vibration Simulation on Electronic Equipment with Micro-systems by Using the Substructure Method

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Yu Fang ; Zhao Lan ; Zhang Ning ; Li Jun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 351 - 355
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480662
Regular:

With the rapid development of high-integrated packaging technology, micro-systems such as SiP (System in Package) and SoC (System on Chip) have been gradually used in aerospace electronic... View More

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