IEEE - Institute of Electrical and Electronics Engineers, Inc. - Optimal Design of Reliability and Signal Integrity for Embedded Micro-scale BGA Solder Joint

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Liang-kun Lu ; Jian-pei Wang ; Chun-yue Huang ; He Wei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 47 - 51
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480802
Regular:

A finite element analysis model of ball grid array(BGA) solder joints and a three-dimensional electromagnetic simulation model were established, respectively. Then calculated the thermal fatigue... View More

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