IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mechanism of Ni 3 Sn 4 rapid formation of Sn-Ni mixed particles paste in ultrasound-assisted TLP for power electronic chip attachment

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Jiayi Huang ; Hongjun Ji ; Hao Pan ; Fanqi Yin ; Hao Liu ; Jiaao Yu ; Mingyu Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 1,263 - 1,268
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480508
Regular:

In the field of semiconductors, the rapid development of third-generation semiconductors represented by SiC and GaN makes it possible for IC chips to work properly in harsh environments at high... View More

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