IEEE - Institute of Electrical and Electronics Engineers, Inc. - Using RBF algorithm for Scanning Acoustic Microscopy inspection of flip chip

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Fan Liu ; Mengying Fan ; Zhenzhi He ; Xiangning Lu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 112 - 114
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480418
Regular:

With the increasing prevalence of flip-chip technology in high density assembly, more attention has been paid to the microbump defect inspection in the flip chip. However, the traditional... View More

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