IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research on Motion Simulation of Wafer Handling Robot Based on SCARA

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Yunbo He ; Jiajun Chen ; Jian Gao ; Chengqiang Cui ; Zhijun Yang ; Xun Chen ; Yun Chen ; Kai Zhang ; Hui Tang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 734 - 739
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480663
Regular:

In the process of semiconductor manufacturing, the wafer handling robot has become an key device. The stability and repeatability of the transfer process directly or indirectly affect the... View More

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