IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Da-quan Xia ; Dong-hua Yang ; Xin Liu ; Yu-feng Zhou ; Gui-sheng Gan ; Yi-ping Wu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 1,696 - 1,701
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480589
Regular:

Nano-particles active-flux and ultrasonic were utilized to achieve Cu/Cu joint with low temperature and fast soldering (180s). The shear strength of SAC0307 solder joint can reach 22.15MPa. The... View More

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