IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research on Vibration Reliability of DIP Surface-Mounted Solder Joint after Pin Bend

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Tao Lu ; Yabin Zou ; Xiao He ; Baojun Qiu ; Hui Xiao ; Bin Zhou
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 1,457 - 1,460
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480664
Regular:

In order to facilitate the entire board reflow process, the pin of a DIP(Dual In-line Package) component is bent into a gull-wing type pin. However, after a short period of service, the failure of... View More

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