IEEE - Institute of Electrical and Electronics Engineers, Inc. - Research on the Effect of Mechanical Bending on Signal Transmission Characteristics of FPC

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Author(s): Ruiqiang Tang ; Dejian Zhou ; Ting Lei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Shanghai, China, China
Conference Date: 8 August 2018
Page(s): 1,611 - 1,614
ISBN (Electronic): 978-1-5386-6386-8
ISBN (USB): 978-1-5386-6385-1
DOI: 10.1109/ICEPT.2018.8480520
Regular:

In order to study the problem of signal integrity caused by mechanical bending in flexible printed circuit board(FPC), the flexible substrate interconnection model under unbending and bending... View More

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