IEEE - Institute of Electrical and Electronics Engineers, Inc. - Tip Deflection of a Thermal Bimorph Cantilever Beam with Different Geometrical Structures

2018 IEEE International Conference on Semiconductor Electronics (ICSE)

Author(s): Z. H. A. Rahman ; M. H. Md. Khir ; M. A. Zakariya
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2018
Conference Location: Kuala Lumpur, Malaysia, Malaysia
Conference Date: 15 August 2018
Page(s): 81 - 84
ISBN (Electronic): 978-1-5386-5283-1
ISBN (USB): 978-1-5386-5282-4
DOI: 10.1109/SMELEC.2018.8481310
Regular:

The residual stress is often due to a thermal mismatch in the thermal expansion coefficient (CTE) between the two materials. This phenomenon causes device failure such as curling, buckling, and... View More

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