IEEE - Institute of Electrical and Electronics Engineers, Inc. - Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes

Author(s): Andrew W. Shang ; Jeffery C. C. Lo ; S. W. Ricky Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2018.2869641
Regular:

Light-emitting diode (LED) devices depend strongly on proper thermal management to mitigate negative effects caused by high operating temperature, especially in general lighting applications.... View More

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