IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel Solder Alloy: Wide Service Temperature Capability for Automotive Applications

Author(s): Jie Geng ; HongWen Zhang ; Francis Mutuku ; Ning-Cheng Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2018
Volume: 5
Page(s): 56 - 62
ISSN (Electronic): 2329-9215
ISSN (Paper): 2329-9207
DOI: 10.1109/MPEL.2018.2850739
Regular:

With automotive electronics booming, more sensors and power moderators are increasingly required for electrical vehicles and self-driving cars. Lead-free tin-silver-copper (SnAgCu), also known as... View More

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