IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere

Author(s): Haidong Yan ; Yun-Hui Mei ; Xin Li ; Changsheng Ma ; Guo-Quan Lu
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1 - 7
ISSN (Electronic): 1557-9646
ISSN (Paper): 0018-9383
DOI: 10.1109/TED.2018.2867362
Regular:

This paper proposed a new approach to attach power devices on nonmetallized direct bonding copper (DBC) substrates by pressureless sintering of nanosilver paste in poor-oxygen sintering atmosphere... View More

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