IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of Cu-Graphene Interconnects

Author(s): Zi-Han Cheng ; Wen-Sheng Zhao ; Da-Wei Wang ; Jing Wang ; Linxi Dong ; Gaofeng Wang ; Wen-Yan Yin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Electronic): 2169-3536
DOI: 10.1109/ACCESS.2018.2869468
Regular:

The Cu/low-k interconnect technology may be still the only option for future technology nodes as the innovative solutions are immature. Due to its ultrathin feature, graphene has been recently... View More

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