IEEE - Institute of Electrical and Electronics Engineers, Inc. - Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

Author(s): Jaehyun Lee ; Salim Berrada ; Fikru Adamu-Lema ; Nicole Nagy ; Vihar P. Georgiev ; Toufik Sadi ; Jie Liang ; Raphael Ramos ; Hamilton Carrillo-Nunez ; Dipankar Kalita ; Katharina Lilienthal ; Marcus Wislicenus ; Reeturaj Pandey ; Bingan Chen ; Kenneth B. K. Teo ; Goncalo Goncalves ; Hanako Okuno ; Benjamin Uhlig ; Aida Todri-Sanial ; Jean Dijon ; Asen Asenov
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2018
Volume: 65
Page(s): 3,884 - 3,892
ISSN (Electronic): 1557-9646
ISSN (Paper): 0018-9383
DOI: 10.1109/TED.2018.2853550
Regular:

In this paper, we report a hierarchical simulation study of the electromigration (EM) problem in Cu-carbon nanotube (CNT) composite interconnects. This paper is based on the investigation of the... View More

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