IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analytical Multistage Thermal Model for FEOL Reliability Considering Self-and Mutual-Heating

Author(s): Wangyong Chen ; Linlin Cai ; Kai Zhao ; Xing Zhang ; Xiaoyan Liu ; Gang Du
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2018
Volume: 65
Page(s): 3,633 - 3,639
ISSN (Electronic): 1557-9646
ISSN (Paper): 0018-9383
DOI: 10.1109/TED.2018.2853713
Regular:

Aggressively scaled devices with high power density wrapped around the low thermal conductivity material in narrow space are susceptible to self-heating effect, which includes serious... View More

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