IEEE - Institute of Electrical and Electronics Engineers, Inc. - On Bundling and Pricing of the Service with the Product

3rd Annual IEEE Conference on Automation Science and Engineering

Author(s): S. Kameshwaran ; N. Viswanadham ; V. Desai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2007
Conference Location: Scottsdale, AZ, USA
Conference Date: 22 September 2007
Page(s): 652 - 657
ISBN (CD): 978-1-4244-1154-2
ISBN (Paper): 978-1-4244-1153-5
DOI: 10.1109/COASE.2007.4341685
Regular:

Integration of service with product is considered as one of the innovative supply chain initiatives of the next decade. In this paper we consider the problem of product-service bundling and... View More

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