IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability Concerns of Lead-free Solder Use in Aerospace Applications

2007 3rd International Conference on Recent Advances in Space Technologies

Author(s): I. Baylakoglu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2007
Conference Location: Istanbul, Turkey
Conference Date: 14 June 2007
Page(s): 158 - 164
ISBN (CD): 1-4244-1057-6
ISBN (Paper): 1-4244-1056-8
DOI: 10.1109/RAST.2007.4283969
Regular:

In this paper, it has been provided the impact of lead free solder use in electronics to the aerospace electronics in the aerospace environment. These impacts especially have been faced in the... View More

Advertisement