IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assembly Subcontractor Quality Management in Foundry

2007 International Symposium on High Density Packaging and Microsystem Integration

Author(s): B. Wu ; K. Chien ; Chorng Niou ; V. Cao ; E. Xia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2007
Conference Location: Shanghai, China
Conference Date: 26 June 2007
Page(s): 1 - 10
ISBN (CD): 1-4244-1253-6
ISBN (Paper): 1-4244-1252-8
DOI: 10.1109/HDP.2007.4283559
Regular:

Semiconductor manufacturing process is becoming more and more complex while manufacturing technology is developed to deep sub-micron region. Therefore, more and more company is turning to... View More

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