IEEE - Institute of Electrical and Electronics Engineers, Inc. - High Value Passive Component Integration in LTCC Technology

2007 International Microwave Symposium (IMS 2007)

Author(s): E.E. Hoppenjans ; W.J. Chappell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2007
Conference Location: Honolulu, HI, USA
Conference Date: 3 June 2007
Page(s): 1,913 - 1,916
ISBN (CD): 1-4244-0688-9
ISBN (Paper): 1-4244-0687-0
ISSN (Paper): 0149-645X
DOI: 10.1109/MWSYM.2007.380147
Regular:

This paper presents the use of a unique component geometry to fabricate large valued inductors buried in an LTCC substrate. The large valued inductors presented create a self shielding buried... View More

Advertisement