IEEE - Institute of Electrical and Electronics Engineers, Inc. - Attaining Thermal Integrity in Nanometer Chips

2007 IEEE International Symposium on Circuits and Systems (ISCAS)

Author(s): Ja Chun Ku ; Y. Ismail
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: New Orleans, LA, USA
Conference Date: 27 May 2007
Page(s): 3,223 - 3,226
ISBN (CD): 1-4244-0921-7
ISBN (Paper): 1-4244-0920-9
ISSN (Electronic): 2158-1525
ISSN (Paper): 0271-4302
DOI: 10.1109/ISCAS.2007.378158
Regular:

As technology moves into the nanometer era, undesirable trends such as increasing power density, leakage power, and temperature variation within a chip have made thermal effects emerge as a major... View More

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