IEEE - Institute of Electrical and Electronics Engineers, Inc. - Extraction of Sheet Resistance and Linewidth from All-Copper ECD Test Structures Fabricated from Silicon Preforms

IEEE International Conference on Microelectronic Test Structures, ICMTS 2007

Author(s): B.J.R. Shulver ; A.S. Bunting ; A.M. Gundlach ; L.I. Haworth ; A.W.S. Ross ; S. Smith ; A.J. Snell ; J.T.M. Stevenson ; A.J. Walton ; R.A. Allen ; M.W. Cresswell
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2007
Conference Location: Tokyo, Japan
Conference Date: 19 March 2007
Page(s): 14 - 19
ISBN (CD): 1-4244-0781-8
ISBN (Paper): 1-4244-0780-X
DOI: 10.1109/ICMTS.2007.374447
Regular:

Test structures have been fabricated to allow electrical critical dimensions (ECD) to be extracted from copper features with dimensions comparable to those replicated in IC interconnect systems.... View More

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