IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization and Modeling of Thin Film Interface Strength Considering Mode Mixity

2007 Electronic Components and Technology Conference

Author(s): A. Xiao ; L.G. Wang ; W.D. van Driel ; L.J. Ernst ; O. van der Sluis ; D.G. Yang ; G.Q. Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,925 - 1,930
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.374063
Regular:

Interfacial delamination is a common cause of failure in microelectronic packages. Characterization and prediction of interface behavior in manufacturing, testing and application conditions is... View More

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