IEEE - Institute of Electrical and Electronics Engineers, Inc. - Massive Spalling of Intermetallics in Solder Joints: a General Phenomenon that Can Occur in Multiple Solder-Substrate Systems

2007 Electronic Components and Technology Conference

Author(s): S.C. Yang ; C.R. Kao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,825 - 1,830
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.374045
Regular:

The massive spalling phenomenon refers to the detachment of intermetallic compound from the substrate or the under bump metallurgy (UBM) surface in a very large scale during reflow. In addition to... View More

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