IEEE - Institute of Electrical and Electronics Engineers, Inc. - Sources of Creep Data Scattering of Solders in Micro-electronic Packaging

2007 Electronic Components and Technology Conference

Author(s): Jin Yu ; S.W. Shin ; S.B. Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,796 - 1,801
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.374040
Regular:

A large scattering of creep data of Pb-free solders existing in literature was investigated by conducting controlled experiments using Sn-3.5Ag alloy. Tensile specimens with different... View More

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