IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

2007 Electronic Components and Technology Conference

Author(s): Hyoung-Joon Kim ; Kyung-Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,707 - 1,713
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Electronic): 2377-5726
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.374025
Regular:

The effect of final metal finishes of Cu electrodes on the adhesion and reliability of anisotropic conductive film (ACF) joints was investigated. Two different metal surface finishes, electroless... View More

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