IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Performance Enhancement for CSP Packages

2007 Electronic Components and Technology Conference

Author(s): D. Retuta ; Y.Y. Ma ; R. Kanth ; Tan Hien Boon ; A. Sun ; S. Tanary
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,690 - 1,695
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.374022
Regular:

Attaching heat spreader into the IC package is a known and common solution for devices with specific thermal requirement. This is usually seen on medium to big size packages such as PBGA where... View More

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