IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability of Cu Wire Bonding to Al Metallization

2007 Electronic Components and Technology Conference

Author(s): L. England ; T. Jiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,604 - 1,613
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.374009
Regular:

The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant cost savings due to cheaper raw material cost, higher electrical... View More

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