IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multi-layer Copper-Dielectric Adhesion Challenges of 5-12 micron Lines/Spaces for Next Generation SOP (System-on-Package) / Microprocessor Package Substrates

2007 Electronic Components and Technology Conference

Author(s): B. Wiedenman ; V. Sundaram ; Fuhan Liu ; G. Krishnan ; H. Roberts ; P. Brooks ; K. Johal ; M. Iyer ; R.R. Tummala
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,431 - 1,435
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Electronic): 2377-5726
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373983
Regular:

System-On-Package (SOP) is a highly integrated systems packaging technology for convergent computing, communication, consumer, and bio-electronic functions in a single package or module. SOP aims... View More

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