IEEE - Institute of Electrical and Electronics Engineers, Inc. - Realization of Electrical-Optical-Circuit-Board Self-packaging

2007 Electronic Components and Technology Conference

Author(s): D.K. Cai ; A. Neyer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,368 - 1,374
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Electronic): 2377-5726
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373973
Regular:

A novel self-packaging technique of electrical-optical circuit boards (EOCB) has been developed based on a combination of a patented PDMS waveguide fabrication technique and a process for... View More

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