IEEE - Institute of Electrical and Electronics Engineers, Inc. - Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch Interconnect

2007 Electronic Components and Technology Conference

Author(s): Yi Li ; Myung Jin Yim ; Kyung Sik Moon ; C.P. Wong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,350 - 1,355
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373970
Regular:

In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs)... View More

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