IEEE - Institute of Electrical and Electronics Engineers, Inc. - C4NP Technology for Lead Free Solder Bumping

2007 Electronic Components and Technology Conference

Author(s): E. Laine ; E. Perfecto ; B. Campbell ; J. Wood ; J. Busby ; J. Garant ; L. Guerin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,320 - 1,325
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373966
Regular:

C4NP is a novel solder bumping technology developed by IBM that addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free... View More

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