IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly Process

2007 Electronic Components and Technology Conference

Author(s): G. Ramakrishna ; B. Nandagopal ; T. Dick ; A. Burton ; R. Higdon ; M. Anvari ; M. Hu ; Sue Teng ; Jie Xue
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,313 - 1,319
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373965
Regular:

A comprehensive study was undertaken to evaluate various board design parameters, assembly and reliability of 0201's as it relates to high reliability products. The design parameters considered... View More

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