IEEE - Institute of Electrical and Electronics Engineers, Inc. - Challenges in Temperature Cycling Test for Electronic Packages Containing Low-K/Cu Silicon

2007 Electronic Components and Technology Conference

Author(s): Chu-Chung Lee ; Tu Anh Tran ; Yuan Yuan ; Chin-Teck Siong ; T.B. Lau
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Reno, NV, USA
Conference Date: 29 May 2007
Page(s): 1,186 - 1,192
ISBN (CD): 1-4244-0985-3
ISBN (Paper): 1-4244-0984-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2007.373944
Regular:

The cavity-down thermally enhanced tape ball grid array (TBGA) package has generally challenged the assembly industry on passing package qualification requirement especially temperature cycling... View More

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